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NUMERICAL STUDY FOR HEAT TRANSFER ENHANCEMENT USING CuO-WATER NANOFLUIDS THROUGH MINI-CHANNEL HEAT SINKS FOR MICROPROCESSOR COOLINGopen access

Anwar, M[Anwar, Muhammad]; Tariq, HA[Tariq, Hussain Ahmed]; Shoukat, AA[Shoukat, Ahmad Adnan]; Ali, HM[Ali, Hafiz Muhammad]; Ali, H[Ali, Hassan]

ArticleIssue Date2020CitationTHERMAL SCIENCE, v.24, no.5, pp.2965 - 2976PublisherVINCA INST NUCLEAR SCI
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