Digital twin-based architecture for wire arc additive manufacturing using OPC UA

Abstract

This paper presents a digital twin (DT)-based architecture for wire arc additive manufacturing (WAAM) utilizing Open Platform Communications Unified Architecture (OPC UA) for enhanced communication, security, and real-time control. DT is explored at both enterprise management and individual asset scales, providing a comprehensive framework for process optimization. The proposed architecture integrates advanced 3D visualization, real-time defect prediction using convolutional neural networks (CNNs), and structured data management. A practical case study involving a 6-degree-of-freedom (DOF) industrial robotic arm demonstrates the application of the architecture in a WAAM deposition scenario. The architecture's effectiveness is evaluated, focusing on anomaly detection, joint angle accuracy, and communication reliability, highlighting the integration of computer vision and cloud-based data storage. The results indicate significant improvements in defect detection, process monitoring, and real-time interaction between the physical entity and the DT, underscoring the potential of the proposed DT architecture. © 2024 Elsevier Ltd