Khan, D.; Oh, S.J.; Shehzad, K.; Verma, D.; Khan, Z.H.N.; Pu, Y.G.; Lee, M.; Hwang, K.C.; Yang, Y.; Lee, K.-Y.
ArticleIssue Date2019CitationIEEE Microwave and Wireless Components Letters, v.29, no.6, pp 415 - 417PublisherInstitute of Electrical and Electronics Engineers Inc.