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SCIESCOPUS

Design and fabrication of screen-printed silver circuits for stretchable electronics

Kim, KS[Kim, Kwang-Seok]; Jung, KH[Jung, Kwang-Ho]; Jung, SB[Jung, Seung-Boo]

ArticleIssue Date2014CitationMICROELECTRONIC ENGINEERING, v.120, pp.216 - 220PublisherELSEVIER SCIENCE BV

KCI

페라이트계 스테인리스강의 마찰교반접합

안병욱[안병욱]; 최돈현[최돈현]; 연윤모[연윤모]; 정승부[정승부]

ArticleIssue Date2014Citation대한용접접합학회지, v.32, no.2, pp.14 - 17Publisher대한용접접합학회

SCIESCOPUS

Effect of surface finishes on electromigration reliability in eutectic Sn-58Bi solder joints

Kim, JH[Kim, Jae-Ha]; Lee, YC[Lee, Young-Chul]; Lee, SM[Lee, Sang-Min]; Jung, SB[Jung, Seung-Boo]

ArticleIssue Date2014CitationMICROELECTRONIC ENGINEERING, v.120, pp.77 - 84PublisherELSEVIER SCIENCE BV

SCOPUSESCI

Pressureless transient liquid phase bonding using SAC305 with hybrid Ag particles and its reliability under high-temperature storage test

Hwang, B.-U.; Min, K.D.; Lee, C.-J.; Kim, J.-H.; Jung, S.-B.

ArticleIssue Date2020CitationMaterialia, v.12PublisherElsevier B.V.

SCIESCOPUS

Screen-Printed Cu Circuit for Low-Cost Fabrication and Its Electrochemical Migration Characteristics

Jung, KH[Jung, Kwang-Ho]; Kim, KS[Kim, Kwang-Seok]; Park, BG[Park, Bum-Geun]; Jung, SB[Jung, Seung-Boo]

ArticleIssue Date2014CitationJOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.14, no.12, pp.9493 - 9497

SCIESCOPUS

Effects of Plasma Polymerized Acrylic Acid Film on the Adhesion of Ag Tracks Screen-Printed on Polyimide

Kim, KS[Kim, Kwang-Seok]; Myung, WR[Myung, Woo-Ram]; Jung, SB[Jung, Seung-Boo]

ArticleIssue Date2012CitationJOURNAL OF ADHESION, v.88, no.4-6, pp.337 - 349PublisherTAYLOR & FRANCIS LTD

SCIESCOPUS

Thermal Resistance of Light Emitting Diode PCB with Thermal vias

Lee, HS[Lee, Hyo Soo]; Shin, HW[Shin, Hyung Won]; Jung, SB[Jung, Seung Boo]

ArticleIssue Date2012CitationJOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.12, no.4, pp.3210 - 3213PublisherAMER SCIENTIFIC PUBLISHERS

Fabrication of SiCp/2024 composite alloys using friction stir welding and its mechanical properties

Ahn B.-W.[Ahn B.-W.]; Choi D.-H.[Choi D.-H.]; Kim J.-H.[Kim J.-H.]; Yeon Y.-M.[Yeon Y.-M.]; Kim D.-U.[Kim D.-U.]; Shin Y.-E.[Shin Y.-E.]; Jung S.-B.[Jung S.-B.]

ArticleIssue Date2015CitationScience of Advanced Materials, v.7, no.8, pp.1535 - 1539

SCIESCOPUS

Microwave Sintering of Silver Nanoink for Radio Frequency Applications

Kim, KS[Kim, Kwang-Seok]; Park, BG[Park, Bum-Geun]; Jung, KH[Jung, Kwang-Ho]; Kim, JW[Kim, Jong-Woong]; Jeong, MY[Jeong, Myung Yung]; Jung, SB[Jung, Seung-Boo]

ArticleIssue Date2015CitationJOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.15, no.3, pp.2333 - 2337PublisherAMER SCIENTIFIC PUBLISHERS

SCIESCOPUS

Evaluation of the Flexibility of Silver Circuits Screen-Printed on Polyimide with an Environmental Reliability Test

Kim, KS[Kim, Kwang-Seok]; Lee, YC[Lee, Young-Chul]; Ahn, JH[Ahn, Jee-Hyuk]; Jung, SB[Jung, Seung-Boo]

ArticleIssue Date2011CitationJOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.11, no.7, pp.5806 - 5811

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