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SCIESCOPUS

Experimental Evaluation of the Effect of Pad Debris Size on Microscratches during CMP Process

Yang, JC[Yang, Ji Chul]; Kim, H[Kim, Hojoong]; Oh, DW[Oh, Dong Won]; Won, JH[Won, Jai-Hyung]; Lee, CG[Lee, Chil-Gee]; Kim, T[Kim, Taesung]

ArticleIssue Date2013CitationJOURNAL OF ELECTRONIC MATERIALS, v.42, no.1, pp.97 - 102PublisherSPRINGER

SCIESCOPUS

Effects of diamond size of CMP conditioner on wafer removal rates and defects for solid (non-porous) CMP pad with micro-holes

Yang, JC[Yang, Ji Chul]; Choi, JH[Choi, Joo Hoon]; Hwang, T[Hwang, Taewook]; Lee, CG[Lee, Chil-Gee]; Kim, T[Kim, Taesung]

ArticleIssue Date2010CitationINTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, v.50, no.10, pp.860 - 868PublisherELSEVIER SCI LTD

SCIESCOPUS

CMOS temperature sensor with ring oscillator for mobile DRAM self-refresh control

Kim, CK[Kim, Chan-Kyung]; Lee, JG[Lee, Jae-Goo]; Jun, YH[Jun, Young-Hyun]; Lee, CG[Lee, Chil-Gee]; Kong, BS[Kong, Bai-Sun]

ArticleIssue Date2007CitationMICROELECTRONICS JOURNAL, v.38, no.10-11, pp.1042 - 1049PublisherELSEVIER SCI LTD

Redundancy analysis simulation in semiconductor manufacturing for yield improvement

Han, Y.[Han, Y.]; Lee, C.[Lee, C.]; Jung, J.J.[ Jung, J.J.]

ArticleIssue Date2009CitationSpring Simulation Multiconference 2009 - Co-located with the 2009 SISO Spring Simulation Interoperability WorkshopPublisherAssociation for Computing Machinery, Inc

SCIESCOPUS

Quality Measurement of Push Services for Smart Devices

An, D[An, Donghyeok]; Woo, H[Woo, Honguk]; Lee, C[Lee, Chilgee]; Yeom, I[Yeom, Ikjun]

ArticleIssue Date2016CitationWIRELESS PERSONAL COMMUNICATIONS, v.88, no.2, pp.319 - 336PublisherSPRINGER

SCIESCOPUS

An enhancement of via profile using MLR mask

Kim, KJ[Kim, Kang-Jin]; Park, JJ[Park, Jong-Jin]; Lee, SH[Lee, Sang-Hun]; Kim, SI[Kim, Sung-Il]; Park, YW[Park, Young-Wook]; Lee, CG[Lee, Chil-Gee]

ArticleIssue Date2011CitationMICROELECTRONIC ENGINEERING, v.88, no.8, pp.2604 - 2607

SCIESCOPUS

Production planning methodology for semiconductor manufacturing based on marketing pattern and linear programming algorithm

Han Y.[Han Y.]; Kim J.M.[Kim J.M.]; Lee C.[Lee C.]

ArticleIssue Date2011CitationInformation, v.14, no.11, pp.3731 - 3738

SCOPUS

A production planning methodology for semiconductor manufacturing based on simulation and marketing pattern

Mok Y.S.[Mok Y.S.]; Park D.[Park D.]; Lee C.[Lee C.]; Han Y.[Han Y.]

ArticleIssue Date2011CitationLecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics), v.6592 LNAI, no.PART 2, pp.363 - 371

A study of devs-based process scheduling on multi-user semiconductor test equipment

Lim S.[Lim S.]; Han Y.[Han Y.]; Lee C.[Lee C.]

ArticleIssue Date2013Citation12th International Conference on Modeling and Applied Simulation, MAS 2013, Held at the International Multidisciplinary Modeling and Simulation Multiconference, I3M 2013, pp.141 - 143

Two-way material transportation method based on 300mm wafer FAB line simulation

Han, Y.[Han, Y.]; Lee, C.[Lee, C.]

ArticleIssue Date2010CitationSpring Simulation Multiconference 2010, SpringSim'10

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