A Hierarchical Short Microneedle-Cupping Dual-Amplified Patch Enables Accelerated, Uniform, Pain-Free Transdermal Delivery of Extracellular Vesicles

Song, Minwoo; Ha, Minji; Shin, Sol; Kim, Minjin; Son, Soyoung; Lee, Jihyun; Hwang, Gui Won; Kim, Jeongyun; Duong, Van Hieu; Park, Jae Hyung; Pang, Changhyun

doi:10.1007/s40820-025-01853-7

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A Hierarchical Short Microneedle-Cupping Dual-Amplified Patch Enables Accelerated, Uniform, Pain-Free Transdermal Delivery of Extracellular Vesicles

Song, Minwoo;
Ha, Minji;
Shin, Sol;
Kim, Minjin;
Son, Soyoung;
... Park, Jae Hyung;
... Pang, Changhyun;
외 4명

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초록

A bio-inspired dual-amplified patch (MN@EV/SC) was fabricated by integrating extracellular vesicle-loaded microneedles with a soft suction chamber for effective transdermal delivery. The MN@EV/SC system achieved an exceptional penetration depth of 290 μm, while minimizing plasma corticosterone levels with short microneedles, ensuring patient comfort through pain-free application. This system showed the potential for dermatological application by revitalizing dermal fibroblasts, and enhancing collagen synthesis through effective delivery of extracellular vesicles while preserving their biological functionality. © The Author(s) 2025.

키워드

Biomimetics; Cupping; Extracellular vesicles; Microneedle; Transdermal patch; CORTICOSTERONE LEVELS; CELLULAR SENESCENCE; SKIN; FIBROBLASTS; COMBINATION; CELLS

제목: A Hierarchical Short Microneedle-Cupping Dual-Amplified Patch Enables Accelerated, Uniform, Pain-Free Transdermal Delivery of Extracellular Vesicles

저자: Song, Minwoo; Ha, Minji; Shin, Sol; Kim, Minjin; Son, Soyoung; Lee, Jihyun; Hwang, Gui Won; Kim, Jeongyun; Duong, Van Hieu; Park, Jae Hyung; Pang, Changhyun

DOI: 10.1007/s40820-025-01853-7

발행일: 2025-07

유형: Article

저널명: Nano-Micro Letters

권: 18

호: 1