ScholarWorks@성균관대학교

초록

This study aimed to prevent blooming and improve the flame retardancy of the resin by synthesizing reactive phosphorus flame retardants and forming a network structure together with resins and curing agents. Through the nucleophilic substitution reaction of phosphorus chloride and acrylic reactants, Tris[2-(methacryloyloxy)ethyl]phosphate (TMOEP), bis(methacryloyloxyethyl)phenyl phosphate (BMOEPP), and methacryloyloxyethyl diphenyl phosphate (MOEDPP) were synthesized. Curing conditions were established through thermal analysis and curing degree measurement, flame retardancy and thermal properties were evaluated, and the action of the flame retardant in a solid phase was confirmed through char formation. As a result, BMOEPP showed the best flame retardancy performance. Through the results of this study, the mechanism for improving the flame retardancy of resin using reactive phosphorus flame retardants was identified, and the applicability of this to high-performance printed circuit board (PCB) materials was suggested.

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