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Investigating geometric design parameters in a manifold microchannel cooling system
- Hyun, Seung-Bong;
- Choi, Won-Woo;
- Senguttuvan, Santhosh;
- Kim, Sung-Min
WEB OF SCIENCE
1SCOPUS
1초록
Although prior studies have examined geometric effects in manifold microchannels, systematic analyses covering a broad range of parameter combinations remain limited. To address this gap, this study comprehensively investigates how geometric design parameters affect the flow and heat transfer characteristics of a manifold microchannel cooling system using air. Three-dimensional numerical simulations are conducted to examine the effects of microchannel height, microchannel inlet and outlet width, and microchannel width. A total of 192 simulations are performed to evaluate the thermal resistance per unit area, average heat transfer coefficient, and pressure drop. The microchannel width has the most significant influence on both the thermal resistance per unit area and the average heat transfer coefficient, while the microchannel height has the greatest impact on the pressure drop. In addition, a new correlation is developed to predict the average Nusselt number for microchannels in manifold microchannel cooling systems.
키워드
- 제목
- Investigating geometric design parameters in a manifold microchannel cooling system
- 저자
- Hyun, Seung-Bong; Choi, Won-Woo; Senguttuvan, Santhosh; Kim, Sung-Min
- 발행일
- 2026-02-09
- 유형
- Article
- 권
- 40
- 호
- 2
- 페이지
- 1481 ~ 1497