Al doping concentration effects in HfO2 ferroelectric memory fabricated via low-temperature PDA annealing
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초록

This study presents high-performance Al-doped HfO2 (HfAlO) ferroelectric thin films for non-volatile memory, processed at a low annealing temperature of 450 degrees C. To overcome the challenge of high annealing temperatures in NVM, we propose a low-temperature solution. Thin films (10 similar to 12 nm) were deposited via atomic layer deposition (ALD) on p-type silicon, with Al doping concentrations of 2 %, 3.2 %, 4 %, 6 %, and 8 % mol. Three Al2O3 layers were interleaved within the HfO2 matrix. Rapid thermal annealing (RTA) was performed at 450 degrees C for 1 or 5 min in nitrogen. Electrical characterization confirmed ferroelectricity activation, with remnant polarization (2Pr) dependent on Al concentration and annealing duration. The best response (2Pr: 18.3-20 mu C/cm(2), storage window: 1 similar to 3.5 V) was observed in 3.2 mol% Al-doped films annealed for 5 min. These findings highlight the potential of precise doping and low-temperature processing for integrating HfAlO into thermally constrained memory technologies.

키워드

HfAlONon-volatile memoryLow-temperature annealingAl dopingPolarizationDOPED HFO2POLARIZATION
제목
Al doping concentration effects in HfO2 ferroelectric memory fabricated via low-temperature PDA annealing
저자
Guo, YumengPan, ZhongZhang, JunzheWang, FuchengChen, JingwenJang, YunhuiKim, Yong-SangSong, Jang-KunKhokhar, Muhammad QuddamahYi, Junsin
DOI
10.1016/j.mseb.2025.118433
발행일
2025-10
유형
Article
저널명
Materials Science & Engineering B: Solid-State Materials for Advanced Technology
320