Cost-Effective High-Speed DRAM Testing: Circuit-Level Enhancements with Clock Multiplication and ECC
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초록

High-speed advanced dynamic random access memory (DRAM) interfaces can exceed 6400 Mbps, placing a significant financial burden on test environments that rely on equivalently high-speed probe cards. This study proposes a method that uses clock multiplication and error correction code (ECC) bypass to enable high-speed testing, even with a more cost-effective, lower-speed probe card. By bypassing the dividing stage in the internally generated delay-locked loop (DLL), the internal clock is effectively multiplied, allowing the DRAM to operate at twice the external clock rate, despite the lower frequency input of the probe card. Furthermore, there is no need to double the read time when retrieving data. The test can be completed simply by adding the time required to read the ECC data. Consequently, the overall test time can be reduced to approximately 62.5 percent of the typical time required in a conventional read scheme. Experiments conducted under a range of voltage conditions confirm that this method effectively detects internal DRAM defects, even when the external operating environment uses a lower frequency. © 2025 IEEE.

키워드

cost-effective verificationDLL clock multiplicationDRAM testingECC bypasslow-cost probe card
제목
Cost-Effective High-Speed DRAM Testing: Circuit-Level Enhancements with Clock Multiplication and ECC
저자
Lee, KyungjunLee, JuyeobPark, Eunil
DOI
10.1109/ICICDT65192.2025.11078066
발행일
2025
유형
Proceedings Paper
저널명
2025 International Conference on IC Design and Technology, ICICDT 2025
페이지
49 ~ 52