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자료 필터
자료유형
발행연도
2008 ~ 2026
2008 2026
키워드
언어
전체 144건 중 1번부터 10번까지의 결과를 표시합니다.
2026
Article
Performance of dual-readout calorimeters for various absorbers
- 2026-10
- Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
- Elsevier B.V.
Article
Recent Advances in the Synthesis and Application of Tellurium Semiconductors
- Yang, Hao ;
- Lyu, Zhiyi ;
- Lee, Hoo-Jeong
- 2026-06-11
- NANOMATERIALS
- MDPI
Article
Retina-Mimetic In-Sensor Visual Processing via Bidirectional Photoconductivity in Encapsulated Tellurium Nanowire Devices
- Kim, Jeehoon ;
- Park, Mose ;
- Kang, Seung-Han ;
- Kang, Dongwon ;
- Park, Sung Kyu ;
- ... Lee, Hoo-Jeong ;
- ... Kim, Yong-Hoon
- 2026-04-01
- Advanced Materials for Optics and Electronics
- WILEY-V C H VERLAG GMBH
Article
Investigation of the mechanical properties of Sn-Bi-In solders for intermediate low-temperature applications
- Choi, Hoon ;
- Kim, Ju-Hyeon ;
- Lee, Hyun-Dong ;
- Lee, Seok-Won ;
- Lee, Eun-Ho ;
- ... Lee, Hoo-Jeong ;
- 외 2명
- 2026-03
- Journal of Alloys and Compounds
- ELSEVIER SCIENCE SA
2025
Article
Modeling framework and discussion of microstructural effects on the formation of Cu–Cu bonding interfaces in semiconductor stacking
- Lee, Jae-Uk ;
- Lee, Hyun-Dong ;
- Oh, Sung-Hyun ;
- Shim, Young-Dae ;
- Kang, Sukkyung ;
- ... Lee, Hoo-Jeong ;
- ... Lee, Eun-Ho ;
- 외 1명
- 2025-12
- International Journal of Plasticity
- Elsevier Ltd
Article
Effects of grain size on bonding performance of Cu-to-Cu bonding
- Lee, Hyun-Dong ;
- Kang, Sukkyung ;
- Kim, Yeo-Jin ;
- Lee, Eun-Ho ;
- Park, Sung-Ho ;
- ... Lee, Hoo-Jeong ;
- 외 6명
- 2025-11
- Journal of Materials Research and Technology
- ELSEVIER
Article
Controlled Synthesis of Tellurium Nanowires and Performance Optimization of Thin-Film Transistors via Percolation Network Engineering
- Park, Mose ;
- Lyu, Zhiyi ;
- Song, Seung Hyun ;
- Lee, Hoo-Jeong
- 2025-07
- NANOMATERIALS
- MDPI
Article
Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB)
- Han, Sang-Eun ;
- Choi, Dong-Gyu ;
- Han, Seonghui ;
- Lee, Tae-Young ;
- Han, Deok-Gon ;
- ... Lee, Hoo-Jeong ;
- 외 1명
- 2025-04-16
- Materials
- MDPI
Article
Effect of Ar/N2 Two-Step Plasma Treatments on the Interfacial Characteristics of Low-Temperature Cu-Cu Direct Bonding
- Kim, Gahui ;
- Choi, Seonghun ;
- Kwon, Yongbeom ;
- Kim, Sarah Eunkyung ;
- Lee, Hoo-Jeong ;
- 외 1명
- 2025-03
- Electronic Materials Letters
- KOREAN INST METALS MATERIALS
Article
Crystal Plasticity-Based Modeling and Experimental Validation of the Influence of Microstructures and Grain Boundary Junction Types on the Cu-Cu Bonding Interface
- Lee, Jae-Uk ;
- Lee, Hyun-Dong ;
- Oh, Sung-Hyun ;
- Park, Sung-Ho ;
- Cho, Won-Seob ;
- ... Lee, Hoo-Jeong ;
- ... Lee, Eun-Ho ;
- 외 4명
- 2025
- Proceedings - Electronic Components and Technology Conference
- Institute of Electrical and Electronics Engineers Inc.
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